Officials from the Commerce Department and the National Science Foundation (NSF) said on Tuesday they are hoping to continue working with the incoming administration on two key technology programs: the Commerce Department’s Tech Hubs program and NSF’s National Artificial Intelligence Research Resource (NAIRR) pilot. […]

Gina Raimondo, Department of Commerce

The Department of Commerce’s Bureau of Industry and Security (BIS) announced a new package of export controls on Monday designed to further curb the People’s Republic of China’s (PRC) ability to make advanced-node semiconductors on its own. […]

The Biden-Harris administration announced today that the Department of Commerce has awarded TSMC Arizona Corporation up to $6.6 billion in direct funding under the CHIPS and Science Act – the first major award finalized under the $52 billion program. […]

semiconductor chips

The Department of Commerce (DoC) announced on Friday that it has signed two separate preliminary agreements under the CHIPS and Science Act to provide Corning up to $32 million in proposed direct funding and Powerex up to $3 million in proposed direct funding. […]

Ron Wyden Oregon

Sen. Ron Wyden, D-Ore., is calling on the Department of Commerce’s Bureau of Industry and Security (BIS) to tighten up its proposed regulations that aim to keep American technologies and expertise out of the hands of repressive foreign nations. […]

semiconductor

The Department of Commerce (DoC) announced Monday it has reached a preliminary agreement with Hemlock Semiconductor (HSC) for up to $325 million in proposed direct funding under the CHIPS and Science Act to support the construction of a new semiconductor-grade polysilicon manufacturing facility on HSC’s existing campus in Hemlock, Mich. […]

The Department of Commerce (DoC) issued a Notice of Funding Opportunity (NOFO) on Oct. 18, officially opening a competition with up to $1.6 billion in funding to support research and development (R&D) activities for semiconductor advanced packaging. […]

semiconductor chips
semiconductor chips

The Department of Commerce (DoC) announced today it has reached a preliminary agreement with Wolfspeed, Inc., for up to $750 million in proposed direct funding under the CHIPS and Science Act to support the construction of a new silicon carbide wafer manufacturing facility in North Carolina. […]

semiconductor chips

The Department of Commerce this week rolled out its new SCALE supply chain risk assessment tool that the agency said will increase the government’s ability to be “more proactive and strategic” about assessing structural supply chain risks across the country.   […]

Department of Commerce
data

The National Telecommunications and Information Administration (NTIA) wants more information on the challenges surrounding data center growth, resilience, and security “amidst a surge of computing power demand due to the development of critical and emerging technologies.” […]

The National Oceanic and Atmospheric Administration (NOAA) has received $100 million in Federal funding to help pay for a new high-performance computer (HPC) system that will harness artificial intelligence and machine learning (AI/ML) capabilities to tackle advanced climate and weather research.   […]

USPTO

The United States Patent and Trademark Office (USPTO) has awarded a $75 million contract to Accenture Federal Services (AFS) to scale the use of artificial intelligence and modernize the patent examination process.   […]

semiconductor

The Department of Commerce (DoC) announced today it has reached a preliminary agreement with HP Inc. for up to $50 million in proposed direct funding under the CHIPS and Science Act to support the expansion of HP’s existing semiconductor facility in Corvallis, Ore. […]

semiconductor chips

A new report out today by the Department of Commerce’s National Telecommunications and Information Administration (NTIA) calls on the Federal government to implement several policy recommendations focused on embracing openness in AI while also calling for active monitoring of risks in powerful AI models. […]

semiconductor chips

The Department of Commerce (DoC) announced today it has reached a preliminary agreement with Amkor Technology for up to $400 million in proposed direct funding under the CHIPS and Science Act to support cutting-edge advanced packaging technology. […]

The Commerce Department said today it signed a non-binding preliminary memorandum with GlobalWafers Co. Ltd. for up to $400 million in funding approved under the CHIPS and Science Act that the company would use to create semiconductor wafer operations in the United States. […]

The chief human capital officer (CHCO) at the Department of Commerce said today that generative AI (GenAI) technologies appear to have a bright future in how government agencies undertake their human resource management work. […]

USPTO
semiconductor chips

The Department of Commerce (DoC) announced on Tuesday that it is launching a competition with up to $1.6 billion in funding, authorized under the CHIPS and Science Act, to support research and development (R&D) activities for semiconductor advanced packaging. […]

Tech Hubs

The Biden administration, through the Department of Commerce’s Economic Development Administration (EDA), announced today $504 million in implementation grants for a dozen technology hubs across the country as part of the second phase of the Tech Hubs program. […]

semiconductor chips

The Department of Commerce (DoC) announced today it has reached a preliminary agreement with Rogue Valley Microdevices (RVM) for up to $6.7 million in direct funding under the CHIPS and Science Act to support the construction of a new semiconductor factory. […]

The Commerce Department’s National Telecommunications and Information Administration (NTIA) component could be doing more to help Tribal authorities with technical assistance as they seek to create and improve broadband services using $3 billion in funding from the Federal government’s Tribal Broadband Connectivity Program (TBCP), according to a new report from the Government Accountability Office (GAO). […]

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